Chinese Tech Firm’s Groundbreaking Achievement 5nm Chips Made Without Lithography Machines
In the field of semiconductors, the focus on miniaturizing chip processes has always been a key aspect of technological advancement. Recently, a Chinese technology company made a significant breakthrough by successfully developing a new manufacturing technology for 5nm chips.
The most notable feature of this technology is its complete departure from the traditional photolithography process, instead adopting a more direct and efficient dry etching technique.
The core of this technology lies in its unique manufacturing process:
1. Chip layout design: Using CAD software, the chip layout is designed with a 5-nanometer etching linewidth, and the design of the etching mask is completed.
2. Mask etching: A high-precision laser direct writing lithography machine is used to etch the mask, ensuring it meets the manufacturing requirements of a 5nm linewidth.
3. Wafer preparation: Prior to chip manufacturing, the wafer is cleaned, dried, and surface-planarized.
4. Etching process: The etching mask is precisely aligned with the wafer surface, and dry etching is performed using plasma to achieve highly accurate etching results.
5. Post-etching steps: After the etching process is completed, the wafer is cleaned and undergoes other conventional chip manufacturing steps.
This innovative technology not only reduces the cost and complexity of chip manufacturing but also significantly enhances manufacturing efficiency and accuracy.
However, it is important to acknowledge that despite the tremendous potential of this technology, large-scale production of high-quality 5nm chips still faces numerous technological challenges.
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