Electrical-Thermal Co-simulation of 3D-IC Structures Using Celsius Thermal Solver

This pre-recorded webinar explains the forces driving electronics designers to utilize advanced 3D packaging methods and shows an analysis of a System on Integrated Chips (SoIC) design. Temperature profiles are plotted for thermal, electrothermal, and transient behaviors using the Celsius™ Thermal Solver. Find more great content from Cadence: Subscribe to our YouTube channel: Connect with Cadence: Website: Facebook: https://