TSP #207 - Teardown & Detailed Analysis of Qualcomm’s 60GHz Multi-Panel Phased Array WiGig System

In this episode Shahriar takes a close look at a wireless-Ethernet product based on Qualcomm’s 60GHz WiGig chipset. The episode is inspired by the upcoming in-person RFIC & IMS IEEE conferences held starting June 19th, 2022 in Denver, Colorado, USA: IEEE Radio Frequency Integrated Circuits Symposium: IEEE International Microwave Symposium: The entire WiGig system architecture is analyzed end-to-end. The phased array module is presented using x-ray images and individual RFIC’s are examined under microscope. ​​​