COM-HPC Mini Academy: What’s New in COM-HPC?

The open and interoperable COM-HPC specification helps satisfy demand for increased compute intelligence in server infrastructure, control endpoints and across edge networking environments. With support for heterogeneous processors up to 150W, an updated high-bandwidth connector, and ample onboard memory capacity, COM-HPC provides a path forward for system architects in need of flexible embedded hardware solutions that will remain relevant for decades. As AI workloads and IoT platform requirements continue to evolve, COM-HPC continues to evolve with them. Now with a new compact “Mini” form factor and updated connector, the potential to support PCI Express Gen 6 and Compute Express Link 3.1 (CXL 3.1), Functional Safety (FuSa) capability, and more, COM-HPC is ready for deployment wherever technologists are building the intelligent edge. This COM-HPC Mini Academy session, brought to you by industry standards organization PICMG, provides an update on the multi-vendor computer-on- module specifica