COM-HPC Mini Academy: Introducing COM-HPC Mini

“Smaller.” “Faster.” “Higher performance.” These describe how miniaturization has impacted technology. They are also what system architects are experiencing with COM-HPC Mini. COM-HPC Mini is the latest form factor in PICMG’s next-generation family of open and interoperable computer-on-module specifications. In a credit card- sized module, it defines support for CPUs, GPUs or FPGAs; interfaces like USB 4.0, PCI Express 5.0 and 10 Gigabit Ethernet; efficient thermal management; soldered memory and more. In this COM-HPC Mini Academy session, brought to you by industry standards organization PICMG, we review the new specification’s electromechanical features and demonstrate how you can leverage them in far edge mobile and battery-powered use cases such as drones, AMRs, HMIs, robotic controllers—and beyond.